Multi Layer Flexible Circuits
When to Use Multilayer Flex Circuits
Shielding applications
Increased circuit density
Dense surface mount assembly
Ground & power plane applications
Controlled impedance with shielding
Required when circuit density and layout preclude routing on a single layer
Multi-Layer Flex Circuit Features
EMI/RFI shielding
Up to eight conductive layers
Controlled impedance with shielding
Compatible with the use of resistive foils like Cupronickel & Constantan
Multi Layer Flex
A multi layer flex circuit combines several single-sided or double sided circuits with complex interconnections, shielding, and surface mounted technologies in a multi layer design. The multi layers may or may not be continuously laminated together throughout the production process. Continuous lamination may be inappropriate if your design needs require maximum flexibility. Multi layer circuits are an effective solution when confronted with design challenges such as unavoidable crossovers, specific impedance requirements, elimination of crosstalk, additional shielding, and high component density.
Compared with traditional single layer or double layer flexible circuit boards, multi layer flexible circuit boards can achieve more complex circuit designs in the same area, increasing wiring density and circuit functions. This structure enables multi layer flexible circuit boards to meet the requirements of modern electronic equipment for miniaturization, high integration, and high performance.
The characteristics of multi layer flexible circuit boards include a high degree of bendability, allowing it to adapt to various complex shapes and space constraints; good conductivity and signal transmission characteristics to ensure the stability and reliability of the circuit; and lighter weight and thin design to help reduce the overall weight and volume of the device.
With the continuous development of electronic technology, the demand for multi layer flexible circuit boards is also growing. It may continue to develop towards higher performance, smaller size, and more flexibility in the future.
Single Sided Flex
Single Sided Flex with Dual Access
Double Sided Flex
Multi Layer Flex
Rigid Flex
Flexible Circuit Technologies is a premier global provider of the design and production of flexible circuit technology
Flexible Circuits, Rigid Flex, Flexible Heaters, Flat Flex Cables, Membrane Switches, Plastic Moldings, Assemblies, Product Module Builds to Complete Product Box Builds.
Bottom line, if you have flex circuit design or flex printed circuit board needs, we can help. contact us
A multi layer flex circuit is a circuit that combines several single-sided or double-sided circuits with complex interconnections. Its advantages are:
- Reduced wiring errors
- Elimination of mechanical connectors
- Unparalleled design flexibility
- Higher circuit density
- More robust operating temperature range
- Stronger signal quality
- Improved reliability and impedance control
- Size and weight reduction
There are many benefits to Flexible Printed Circuits including:
Higher integration
As the requirements for functionality and performance of electronic devices continue to increase, multi layer flexible circuits will pursue higher integration to achieve smaller sizes and more complex circuit designs.
Better reliability
To adapt to various harsh environments and application scenarios, multi layer flexible circuits will continue to improve reliability and durability, such as enhanced resistance to bending, temperature changes, and chemical corrosion.
Reduce assembly errors
With precise design and automated production, flex circuits eliminate human error in hand made wiring harnesses. Except for production-induced errors, circuits are routed only to those points required by the precise design plan.
Reduce assembly time and costs
Flexible circuits require less manual labor during assembly and reduce production errors. Flexible circuits have the inherent ability to integrate form, fit, and function. Flexible circuits eliminate the high cost of wiring, winding, and bonding wires. Install or replace a complete interconnection system rather than individual hard PC boards. As a result, wiring errors are eliminated and manufacturing costs are therefore reduced. Whether it is low volume production of complex circuits or high-volume production of simple circuits, assembly time and cost are reduced.
Intelligence and interconnectivity
The development of the Internet of Things and smart manufacturing will promote the closer integration of multi layer flexible circuits with sensors, wireless communications, and other technologies to achieve more intelligent systems and more efficient interconnections.
Green and environmentally friendly
The manufacturing process may pay more attention to environmental protection and sustainable development, using more environmentally friendly materials and production methods to reduce the impact on the environment.
New Material Applications
Research and develop new materials, such as high performance conductors, insulating materials, and substrates, to improve the performance of multi layer flexible circuits and meet special application needs.
Collaborative design and manufacturing
The design and manufacturing processes will be more closely coordinated, using advanced design tools and simulation technology to improve the design efficiency and manufacturing accuracy of multi layer flexible circuits. These development trends will make multi layer flexible circuits play a more important role in future electronic products and promote the continuous innovation and progress of related technologies.
Customization and personalization
According to the special needs of different industries and applications, multi layer flexible circuits will be more inclined to customization and personalized design to provide the best solutions.
Unlike rigid boards, flexible circuits are not limited to two dimensions. Because they are as flexible as wire or ribbon cable, the design options for flexible circuits are endless. At Flexible Circuits, we pride ourselves on solving the most complex design challenges. Flexible circuits can be designed to accommodate highly complex and unimaginable configurations while being able to operate in the harshest environments. Flexible circuit designs may require any of the following:
- Highly complex configurations
- Withstand hostile operating environments
- Single Double combinations
- Complex interconnections
- Shielding
- Rigid/flex capabilities
- Surface mounted devices
Flexibility during installation
Flexible circuits allow the use of a third dimension because they can be interconnected between two or more planes during execution. Therefore, they solve space and weight issues that rigid boards cannot match. Flexible circuits can be operated multiple times during installation and execution without electronic failure.
High density applications
Flexible circuits allow extremely narrow lines, giving way to high-density device clusters. Dense device counts and lighter conductors can be designed into products, freeing up space for other product features.
Improve airflow
Due to its streamlined design, flex circuits allow cooling air to flow through electronic applications.
Increase heat dissipation
Flexible circuits allow for shorter thermal paths due to their large surface area to volume ratio and compact design. Additionally, the thinner design of the flex circuit allows heat to dissipate from both sides of the circuit.
Improve system reliability
In the past, most circuit failures occurred at interconnection points. Flexible circuit designs can reduce interconnections, thereby increasing circuit reliability.
Point-to-point line replacement
Depending on the number of point-to-point connections in a circuit design, at Flexible Circuits, we guarantee that a single flex circuit can be designed and built to eliminate many, if not all, of these interconnections. At Flex Circuits, “We go where others don’t go.”
Reliability and durability
In designs with moving parts, flexible circuits can move and bend up to 500 million times without failure. Polyimide’s excellent thermal stability also enables circuits to withstand extremely hot applications. The thermal stability of polyimide provides a better foundation for surface mounting than rigid boards. Because a compliant base film places less stress on the solder joint, thermal mismatch is less likely to occur.
repeatable route
Our circuits are made from accurate reproductions of artworks with superior manufacturing consistency. Etched circuitry replaces soldering and hand-wiring connections to rigid boards, eliminating wiring errors.
Simplified circuit geometry
Flex circuit technology places surface mount electronics directly on the circuit, simplifying the overall design. Complex patterns that are nearly impossible to achieve using rigid circuit boards can be easily achieved in flexible circuits.
Package size and weight reduction
Multiple systems on a rigid board create more weight and utilize more space. Flexible circuits contain the thinnest dielectric substrates. The thinness allows for a streamlined design, eliminating the need for bulky rigid panels. Elasticity and flexibility can reduce package size. In addition to reducing package size, reducing package weight is another benefit. As the demands of the electronics industry continue to increase, weight reduction allows flexible circuits to remain very competitive.
In summary, if you have flex circuit design or flex printed circuit board needs, we can help.
flexible printed circuit manufacturers Products Pre-Production
- Shanyo’s in the production process, to prevent too many open and short circuits caused by low yield or reduce drilling, calendering, cutting, and other rough process problems caused by the FPC board scrap, replenishment problems, and assess how to choose the material to achieve the best results for customers to use the flexible circuit boards, pre-production pre-processing is very important.
- Pre-production pre-processing needs to deal with three aspects, these three aspects are completed by engineers.
- FPC board engineering assessment, the company’s production capacity to meet customer board requirements and unit costs.
- Engineering assessment through, immediately preparing materials to meet the raw material supply of each production process.
- Engineer customer’s CAD structural drawings, Gerber line data, and other engineering documents to deal with, to suit the production environment and production specifications of the production equipment.
- Production drawings MI (engineering process card) and other information are delegated to the production department and various departments such as clerical control, procurement, etc., into the regular production process.
Multi Layer Flex Applications
Static application
Flex circuit bending is only used in applications where the circuit is mounted and installed into its application (also known as flex installation or flex installation). Static applications are typically performed using less expensive electroplated (ED) copper.
Dynamic bending applications
A situation where the flexible circuit itself bends dynamically (repeatedly) during actual use of the final product. Common examples include flip phones, laptops, printer heads, and robotic arms. Dynamic applications require the use of roll annealed (RA) copper.
Bottom line, if you have flex circuit design or flex printed circuit board needs, we can help. contact us
The benefits of flexible circuits are realized in most applications requiring high volume flexing and/or a high degree of accuracy. Some common applications include:
- Airbag systems
- Automotive engine controls
- Antilock brakes
- Avionics
- Bar code equipment
- Battery packs
- Calculators
- Cameras
- Cell phones
- Heart monitors and pacemakers
- Fuel pumps
- Hearing aids
- Printers
- Motion systems
- GPS systems
- Satellites
Bottom line, if you have flex circuit design or flex printed circuit board needs, we can help. contact us
Multi Layer Flex Materials
Static application
Flex circuit bending is only used in applications where the circuit is mounted and installed into its application (also known as flex installation or flex installation). Static applications are typically performed using less expensive electroplated (ED) copper.
Dynamic bending applications
A situation where the flexible circuit itself bends dynamically (repeatedly) during actual use of the final product. Common examples include flip phones, laptops, printer heads, and robotic arms. Dynamic applications require the use of roll annealed (RA) copper.
Bottom line, if you have flex circuit design or flex printed circuit board needs, we can help. contact us
Conductors
Copper is the most widely used conductor and comes in various thicknesses to meet each customer’s requirements. Conductor options include:
- Rolled annealed (RA) copper
- Electro deposited (ED) copper
- Aluminum
- Carbon
- Silver ink
- Inconel®
- Constantan
Bottom line, if you have flex circuit design or flex printed circuit board needs, we can help. contact us
Adhesives
Adhesive selection depends on customer needs and conductor thickness. Common adhesives include:
- Epoxy
- Acrylic
- Pressure Sensitive Adhesives (PSAs)
- Adhesiveness (base material)
Bottom line, if you have flex circuit design or flex printed circuit board needs, we can help. contact us
Insulators
Flexible substrate (base) and coverlay materials are available in a variety of thicknesses and from several manufacturers. Common insulators include:
- Polyimide
- Polyester, Polyethylene naphthalate (PEN), and Polyethylene Terephthalate (PET)
- Solder mask
- Flexible solder mask
- Photo image-able coverlay (PIC)
- Screen printed dielectric
Bottom line, if you have flex circuit design or flex printed circuit board needs, we can help. contact us
Surface treatment
The final finish depends on each customer’s assembly requirements and application of the finished product. Common surface treatments include:
Bottom line, if you have flex circuit design or flex printed circuit board needs, we can help. contact us
Printed Circuit Flexible PRODUCT DETAIL
Flexible Printed Circuit Board Manufacturers Production Process
Double-side plate system
Open material → Drilling → PTH → Plating → Pre-treatment → Dry film → Alignment → Exposure → Development → Graphic plating → Stripping → Pre-treatment → Dry film → Alignment → Exposure → Development → Etching → Stripping → Surface treatment → Overlay film → Pressing → Curing → Immersion of nickel and gold → Printing of characters → Cutting → Electrical testing → Punching → Final inspection → Packing → Shipments
China Flexible Printed Circuit Board
Basic Structure
Common double sided laminated composition
Hollow plate composition
The substrate generates a double sided laminated composition
Copper Film
The copper film is divided into electrolytic copper and rolled copper. The common thicknesses are 1oz 1/2oz and 1/3 oz.
Substrate Film: Common thicknesses are 1 mil and 1/2 mil.
Glues: Thickness depends on the customer’s requirement.
Cover Film
Cover Film: For surface insulation. Common thicknesses are 1mil and 1/2mil.
Glues: Thickness depends on the customer’s requirement.
Release Paper: To avoid foreign matter from adhesive before pressing; to facilitate the work.
PI Stiffener Film
PI Stiffener Film: Reinforces the mechanical strength of the FPC and facilitates the surface mounting process. Common thicknesses range from 3mil to 9mil.
Glues: Thickness depends on the customer’s requirement.
Glues (Adhesives): To avoid adhesive from sticking to foreign objects before pressing.
EMI: Electromagnetic shielding film protects the circuit board circuit from outside (a strong electromagnetic area or susceptible to interference area) interference.
Bottom line, if you have flex circuit design or flex printed circuit board needs, we can help. contact us
Flexible Printed Circuits FPC Advantages
FPC is a printed circuit made of flexible insulating substrate, with many advantages that rigid printed circuit boards do not have:
- can be free to bend, coil, and fold, according to the requirements of the spatial layout of any arrangement, and in three-dimensional space, arbitrary movement, and expansion, to achieve the integration of component assembly and wire connection;
- The use of FPC can greatly reduce the volume and weight of electronic products, applicable electronic products to high-density, miniaturization, and high reliability in the direction of development needs. Therefore, FPC in aerospace, military, mobile communications, laptop computers, computer peripherals, PDA, digital cameras, and other fields or products have been widely used;
- FPC also has good heat dissipation and solderability as well as easy to install and connect, has a lower overall cost, and has other advantages.
Order Fpc Flexible Printed Circuit: Easy & Fast
Instant Quotation
Online Annotation
Say goodbye to tedious back-and-forths. Directly annotate your 3D drawing online and convey specific changes or queries instantly via live chat. Ensure precise machining requirements are communicated and understood without ambiguity.
All-in-One Project Management
Team Collaboration
Services
Why Choose Our Custom flexible printed circuit design Service
Online Instant Quote & DFM Analysis
Fast and Reliable Delivery
Boasting robust manufacturing capacity, Shanyo’s ensures quick turnaround for tactile dome machined parts. Plus, with our varied dome array(snap dome switch) choices, you’ll get your order on time, without the usual hassles.
Consistent High Quality
Advanced metal dome automatic assembly equipment multi-function testing equipment, and rigorous quality checks, combined with constant communication, ensure that every snap dome you receive meets the highest standards, consistently and reliably.
Professional Engineering Support
No matter where you are, you can get our 24/7 engineering support all year around. Our experienced engineer can provide you with the most appropriate solution for your metal dome customized design, material selection, surface finishing, and even lead time.
COMPANY CORE ADVANTAGE
Share innovation
Professional
Overseas Quality
Rich products
from round, cross (four corners), waist round shrapnel to custom shrapnel, from single-layer structure, double-layer structure, EMI printing, and Rubber structure.
Strict control
High-quality service
punctual delivery; free technical solutions and samples; quick response customers respond 1 hour after mail receipt; after-sales service 1 hour fast processing.
SHANYO PARTNER
FAQs
Frequently Asked Questions
Q1: Are you a Trading Company or Manufacturing?
- We are a Professional Metal dome manufacturer, we have our own factory, and we are based in Qingdao, China, Shanyo Precision Electronic Technology Co., Ltd. is a professional manufacturer of mobile phones and digital product components. It was established in 2004 and has more than 200 employees. The main business is applied in consumer electronics, remote controls, mobile phones, automobiles, medical care, smart products, outdoor products, etc. The main products are metal dome array, Remote control buttons, die cutting, LGF, UV bumps, FPC, panel buttons, PCB lines, thin film flexible lines, etc. The Qingdao factory covers an area of more than 3,500 square meters. Currently, it has offices in Shenzhen, Shanghai, Taiwan, Malaysia, and Singapore, fully implementing the global marketing strategy. sell to Southern Europe (10.00%), Domestic Market (10.00%), Northern Europe (10.00%), Central America (10.00%), Western Europe (10.00%), Eastern Europe (10.00%), South America (10.00%), North America (10.00%), South Asia (5.00%), Southeast Asia (5.00%), Eastern Asia (3.00%), Oceania (3.00%), Mid East (2.00%), Africa (2.00%). There are a total of about 51-100 people in our office.
Q2. How do I request samples of your products?
- Stock Samples: If you paid the freight cost, we could provide free samples for you.
- Customized Samples: We will offer you 5 pcs free samples after we receive the setup cost.
- To request product samples, please email us at shanyonod@shanyo.com.
Q3.How do I request a quote?
- You can easily request a quote by filling out our Quote Form, or by sending us an e-mail at shanyonod@shanyo.com.
Q4. how can we guarantee quality?
- We process and produce products in strict accordance with the list of raw materials.
- Many of our engineers have many years of experience and are very responsible.
Always a pre-production sample before mass production;
Always final Inspection before shipment.
And video confirmation of packing with the customer.
Q5. Can you offer OEM Service?
- Surely Okay, we have Seasoned OEM service experience.
Q6. what is the Lead time of the sample?
- It takes 2-7 working days depending.
Q7. How fast can I get the Quotation?
- 30 mins ~ 24 Hours depends.
Q8. How to place an order?
- Please tell us your material, artwork design, logic circuit schematic diagram, size, surface, usage, etc. It is best to send us the design drawings or samples and other detailed data, and then we will customize the metal dome and metal dome array according to your requirements.
Q9. What services can we provide?
Accepted Payment Currency: USD, EUR, HKD, CNY;
Accepted Payment Type: T/T, L/C, MoneyGram, PayPal, Western Union, Escrow;
Language Spoken: English, Chinese
Q10. What products are die-cut?
- The die-cutting process is suitable for a variety of materials, including metal, plastic, paper, fabric, foam, wood, and composites.
Q11. Advantages of metal dome technology:
- Durability: Metal domes are highly durable and can withstand millions of actuations without failure. This makes them ideal for use in devices that are used frequently, such as keyboards and keypads.
- Consistency: Metal domes provide a consistent tactile response, which means that users can rely on the same level of feedback every time they press a button. This can improve user experience and accuracy.
- Cost-effectiveness: Metal domes are relatively inexpensive to manufacture, which makes them a cost-effective solution for manufacturers.
Space-saving: Metal domes are small and can be placed close together, which makes them ideal for use in compact devices. - Customization: Metal domes can be customized with different shapes, sizes, and force requirements to suit the specific needs of a particular device or application. This allows manufacturers to create unique user experiences for their products.
Address:
Factory No. 20, Tianhe Industrial Park, No. 252 Weihe Road, Qingdao Economic and Technological Development Zone
Weihe Road, Qingdao Economic and Technological Development Zone
Shandong, China, 2665
Tel:
+86-13302480516
Email:
shanyonod@gmail.com