How are dome switch packaged?

Shanyo offers several different packaging methods for metal dome switches. Choosing a packaging method that meets the unique requirements of your application and assembly is as important as the product itself. Metal domes are packaged loosely in jars, on polyester adhesive sheets, in boxes or on tape and reel. Each method has unique advantages and helps customers solve corresponding problems.

Dome Switch Bulk packaging

The most commonly requested method is bulk packaging. Whether you need to order a minimum quantity of a test version or order thousands at once, bulk packaging usually requires shorter lead times and can sometimes be shipped the same day.

If you order bulk packaging, the metal domes will be packed in plastic bags or jars with appropriate labels to prevent mixing, shrink-wrapped and completely sealed after packaging to protect and prevent pollution.

In Shanyo’s packaging workshop, each packaging bag containing metal shrapnel undergoes special sterilization treatment.

For precision electronic components, such as metal domes, their cleaning and disinfection during the manufacturing and packaging process is critical to ensure the quality of the product is not contaminated. Here are some possible disinfection methods:

– Ultraviolet disinfection: This is a common disinfection method that uses ultraviolet light to sterilize object surfaces and air. Ultraviolet disinfection is simple to operate, low cost and does not add or produce toxic substances.
– Chemical disinfectants: Use disinfectants with high stability and adaptability, such as Octex, which are not affected by temperature, light, and pH value, and are suitable for workshop production with complex processing techniques. This disinfectant requires no rinsing and can be air-dried, making it suitable for disinfecting and sterilizing any surface.

To sum up, the special treatment and disinfection of metal domes in Shanyo’s packaging workshop is to ensure the quality and safety of the product, which is an important link in the electronics manufacturing industry.

The number of domes packed per bag or jar depends on the dome diameter size and shipping quantity. If you require a specific number of metal domes per bag or jar, we can accommodate this for a small additional fee per order. Another good option to keep in mind is anti-static cans, which will help prevent the dome from sticking to the can. Bulk packaged domes are often used with a vacuum pen, which places the dome on the substrate.

dome array

Standard peel and place
Customers find Shanyo’s standard peel-and-place packaging method easy to place. This option includes manufactured-to-order sheets in which a single dome is attached to a square of pressure-sensitive tape.

Each metal dome is aligned in the center of these individual pre-cut adhesive squares for seamless bonding to the circuit board. Most commonly, our standard peel-and-place packages come in 20 or 30 individually cut square pieces per sheet, depending on the size of the dome.

After the customer gets the product, staff can remove each dome with adhesive from the release liner backing and stick it to a film or circuit board. Adhesive secures the metal dome to the circuit board. Most four-legged and round metal domes come in standard peel-and-place options.

Custom peel and place
Similar to the standard strip-and-place option, custom strip-and-place dome arrays are built and assembled based on the metal dome style and quantity of your choice.
Customers can easily customize and cut the dome array into the desired custom size and shape.
Metal shrapnel of different sizes, series, and forces can be placed on the same array. Meet all design needs. And the paper size is also customizable.
Custom array chip designs are ideal for small and medium-volume applications and can also reduce production costs.
At the same time, customers can precisely place all metal domes on the circuit board, greatly reducing the circuit board assembly process. Using our custom arrays also reduces the possibility of “double domes” and dome placement errors.

Shanyo also provides custom application fixtures and assists customers with customizing the placement process for peel-and-place arrays. Using an application jig, the assembler peels off the array backing layer and places the adhesive side up on the jig.
The worker picks up the board and aligns it with the edge rails, then presses the board down onto the array to secure the placement. Manual placement using application fixtures is faster, more accurate, and more cost-effective than visual alignment.

 

Tape and Reel Metal Dome Switch

Depending on the customer’s packaging specifications, using tape and packaging is the most cost-effective method of mounting a metal dome using automated placement or SMT equipment. In addition, tape and reel can be used for high-volume production.

The package consists of a dome placed in a pocket, secured with embossed tape, and packed on a reel that is handled and shipped by SMT automated placement equipment workshop. You can solder some dome switches (such as SMD domes) directly to the circuit. Therefore, tape and reel packaging options are available for most standard and custom domes.

Metal Domes are commonly used as electronic components, especially as switches on touch screens or keys. In automated placement or surface mount technology (SMT), the installation process of metal domes typically involves the following steps:

1. Tray loading: First, the metal dome will be placed in special trays, which are designed to be compatible with SMT machinery for automatic pick-and-place.

2. Automatic placement machine preparation: The automatic placement machine or SMT equipment needs to be configured according to the size and design of the metal dome. This includes adjusting the pressure, angle, and speed of the pickup head to ensure accurate pick-up and placement of metal domes.

3. Circuit board positioning: The circuit board (PCB) will be fixed on the positioning table of the placement machine and calibrated through the camera system to ensure that the metal dome can be accurately placed at the predetermined position.

4. Mounting process: The mounting machine takes the metal dome out of the tray, then confirms its position and direction through the vision system, and finally places it accurately on the designated pad or contact point on the circuit board.

5. Soldering: In some cases, the metal dome is fixed to the circuit board by soldering. This may involve processes such as reflow or wave soldering, allowing the metal dome to form a strong electrical connection to the circuit board.

6. Inspection and Testing: After installation is complete, the circuit board will be visually inspected and functionally tested to ensure that all metal domes have been installed correctly and are free of defects.

7. Cleaning: The finished circuit board may go through a cleaning process to remove any residue, such as flux residue, that may affect performance.

8. Subsequent processes: After installing the metal dome, the circuit board may continue to undergo other SMT processes, such as installing other electronic components, or performing final packaging.

Throughout the SMT process, accuracy and speed are crucial as they directly affect the performance and production efficiency of the final product. Modern SMT equipment typically has a high degree of automation and precision, capable of handling electronic components of various sizes and shapes.

Choosing the right packaging method varies based on quantity and budget. As the industry leader in snap domes, we can help you find the best product and packaging for your application. No matter the packaging style you choose, Shanyo can accommodate your customers’ requirements, ensuring you receive the highest quality product with consistent characteristics every time you order.